Title :
Facelift: Hiding and slowing down aging in multicores
Author :
Tiwari, Abhishek ; Torrellas, Josep
Author_Institution :
Dept. of Comput. Sci., Univ. of Illinois at Urbana-Champaign, Urbana-Champaign, IL
Abstract :
Processors progressively age during their service life due to normal workload activity. Such aging results in gradually slower circuits. Anticipating this fact, designers add timing guardbands to processors, so that processors last for a number of years. As a result, aging has important design and cost implications. To address this problem, this paper shows how to hide the effects of aging and how to slow it down. Our framework is called Facelift. It hides aging through aging-driven application scheduling. It slows down aging by applying voltage changes at key times - it uses a non-linear optimization algorithm to carefully balance the impact of voltage changes on the aging rate and on the critical path delays. Moreover, Facelift can gainfully configure the chip for a short service life. Simulation results indicate that Facelift leads to more cost-effective multicores. We can take a multicore designed for a 7-year service life and, by hiding and slowing down aging, enable it to run, on average, at a 14-15% higher frequency during its whole service life. Alternatively, we can design the multicore for a 5 to 7-month service life and still use it for 7 years.
Keywords :
circuit reliability; fault tolerance; logic design; microprocessor chips; multiprocessing systems; nonlinear programming; scheduling; synchronisation; Facelift; aging-driven application scheduling; critical path delay; multicore aging hiding; multicore aging slow down; nonlinear optimization algorithm; processor design; processor service life; timing guardband; voltage change; Aging; Circuits; Computer science; Costs; Delay; Frequency; Multicore processing; Processor scheduling; Threshold voltage; Timing;
Conference_Titel :
Microarchitecture, 2008. MICRO-41. 2008 41st IEEE/ACM International Symposium on
Conference_Location :
Lake Como
Print_ISBN :
978-1-4244-2836-6
Electronic_ISBN :
1072-4451
DOI :
10.1109/MICRO.2008.4771785