• DocumentCode
    257948
  • Title

    Dynamic bond percolation in networks

  • Author

    Zhang, June ; Moura, Jose M. F.

  • Author_Institution
    Electr. & Comput. Eng., Carnegie Mellon Univ. Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    942
  • Lastpage
    945
  • Abstract
    Bond percolation is a network process that traditionally addresses the question when there is a path between two sites or two clusters in a network. This has been used to study the circulation of goods or flows in networked structures as well as network resilience. This paper proposes and analyzes a dynamic bond percolation model where bonds (i.e., edges) open (i.e., form) or close (i.e., terminate) according to random micro interactions. We model the edge dynamics through topology independent and topology-dependent processes - spontaneous formation or termination of edges and the formation of edge {a, b} between two sites a and b that depends on the current number of existing edges at a and b. We show that the resulting network process is Markov and reversible, and we determine analytically its equilibrium distribution, avoiding having to solve a eigenvalue-eigenvector problem that quickly becomes intractable for even moderate sized networks.
  • Keywords
    Markov processes; eigenvalues and eigenfunctions; network theory (graphs); percolation; topology; Markov process; dynamic bond percolation model; edge dynamics; edge spontaneous formation; edge termination; eigenvalue-eigenvector problem; equilibrium distribution; network process; random microinteractions; reversible process; topology independent process; topology-dependent process; Conferences; Educational institutions; Markov processes; Network topology; Solids; Symmetric matrices; Topology; bond percolation; edge formation; equilibrium distribution; reversible Markov process; time-varying networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Information Processing (GlobalSIP), 2014 IEEE Global Conference on
  • Conference_Location
    Atlanta, GA
  • Type

    conf

  • DOI
    10.1109/GlobalSIP.2014.7032259
  • Filename
    7032259