DocumentCode :
2579849
Title :
FRAM-the ultimate memory
Author :
Philofsky, Elliott M.
Author_Institution :
Ramtron Corp., Colorado Springs, CO, USA
fYear :
1996
fDate :
24-26 Jun 1996
Firstpage :
99
Lastpage :
104
Abstract :
This paper has described a new nonvolatile technology based on utilizing the ferroelectric properties of PZT thin films. This technology has been applied to manufacture a family of low density serial and parallel memories that combine the fast reads and writes of SRAM and nonvolatility of EEPROM with very high read/write endurance. These products are shown to be superior to equivalent EEPROM products in write speed, write endurance, and overall power consumption. The failure rate of packaged parts has been shown to be less than 60 fits with a 60% confidence level for 10-year data storage at room temperature, which confirms the production worthiness of ferroelectric technology for volume applications. Future developments include high density products with better endurance and retention and the ability to work at lower voltage. As a result, FRAM technology will become the dominant nonvolatile memory technology by the end of this decade
Keywords :
ferroelectric storage; ferroelectric thin films; lead compounds; piezoceramics; random-access storage; reviews; FRAM technology; PZT; PZT thin films; PbZrO3TiO3; ferroelectric RAM; ferroelectric properties; high read/write endurance; low density parallel memories; low density serial memories; nonvolatile memory technology; power consumption; volume applications; EPROM; Energy consumption; Ferroelectric materials; Manufacturing; Nonvolatile memory; Packaging; Random access memory; Read-write memory; Temperature; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nonvolatile Memory Technology Conference, 1996., Sixth Biennial IEEE International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-3510-4
Type :
conf
DOI :
10.1109/NVMT.1996.534679
Filename :
534679
Link To Document :
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