DocumentCode
2579920
Title
A forth order finite differencce scheme for pennes´ bioheat transfer equation in a three? Dimensional triple-layered skin structure with multilevel bloood vessel
Author
Shagoshtaasbi, H.
Author_Institution
Sci. & Res. Branch, IAU, Tehran, Iran
fYear
2009
fDate
18-23 May 2009
Firstpage
146
Lastpage
151
Abstract
The Pennes´ bioheat transferr equation is a well-known heat conduction equation in which has been used for mathematical representation of the temperature distribution in the tissue because of its simplicity in which the heat transfer between the blood vessels and tissue is assumed to occur mainly across the capillaries where blood velocity is low. In this study, a forth-order compact finite difference scheme for solving Pennes´ bioheat transfer equation is applied to model temperature distribution in a three dimensional skin structure with multilevel blood vessel. Numerical experiments for thermal analysis of a skin composed of epidermis, dermis, and subcutaneous layers are conducted. Basically, blood vessels can be heat sink or heat source. As laser increases the temperature of tissue, blood vessels count as a heat sink. This term is modeled to be proportional to the difference between arterial supply temperature and the local tissue teemperature.
Keywords
biothermics; blood vessels; finite difference methods; heat conduction; heat sinks; laser applications in medicine; skin; temperature distribution; 3D triple-layered skin structure; bioheat transfer equation; forth order finite difference scheme; heat conduction equation; heat sink; laser-induced thermal therapy; mathematical representation; multilevel blood vessel; tissue temperature distribution; Blood vessels; Dermis; Difference equations; Epidermis; Finite difference methods; Heat sinks; Heat transfer; Skin; Temperature distribution; Thermal conductivity; Bioheat Transfer; Biological Modeling; Finite Difference Scheme; Laser Tissue Inteeraction; Laser-Induced Thermal Therapy;
fLanguage
English
Publisher
ieee
Conference_Titel
EUROCON 2009, EUROCON '09. IEEE
Conference_Location
St.-Petersburg
Print_ISBN
978-1-4244-3860-0
Electronic_ISBN
978-1-4244-3861-7
Type
conf
DOI
10.1109/EURCON.2009.5167620
Filename
5167620
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