Fabrication of cylinder type micro channel using photoresist reflow and isotropic etching

In this paper we have fabricated cylinder type micro channel using photoresist reflow and isotropic etching. Si substrate, using a Si/sub 3/N/sub 4/ (6000/spl Aring/) as a mask, was selectively etched using a HNA etching system for the bottom hemisphere of the channel. Photoresist reflow was used to make the top of the channel round. Then Si/sub 3/N/sub 4/ was deposited on the reflowed photoresist. Since the deposited Si/sub 3/N/sub 4/ was about 6000 /spl Aring/ thick it is possible to see the inside of the channel. This channel is expected to be applied to simple bio and microfluidic devices in which optical detection is needed.