Title :
Wireless strain sensing microsystem
Author :
Young, Darrin J. ; Ko, Wen H.
Author_Institution :
Dept. of EECS, Case Western Reserve Univ., Cleveland, OH, USA
Abstract :
This paper describes a high-performance wireless strain sensing microsystem. A MEMS capacitive strain sensor converts an input strain to a capacitance change with a sensitivity of 26.5 aF per 0.1 με. Low-noise integrated sensing electronics employing a continuous time synchronous detection architecture convert the capacitive signal to an output voltage for further signal processing. An RF to DC converter based on inductive coupled coils converts a 50 MHz AC signal to a stable DC supply of 2.8 V with a current driving capability of 2 mA, sufficient to power the interface sensing electronics. A two-channel digital phase shift keying (PSK) and amplitude shift keying (LSK) passive telemetry achieve a wireless data transmission rate of 5 Mbps and 250 kbps, respectively, which are adequate for sending the strain data and temperature information for thermal compensation. The prototype microsystem achieves a minimum detectable strain of 0.9 nε/ √Hz with a maximum input strain of 1000 με.
Keywords :
amplitude shift keying; capacitive sensors; data communication equipment; micromechanical devices; phase shift keying; signal processing; strain sensors; telemetry; voltage-frequency convertors; wireless sensor networks; 2 mA; 2.8 V; MEMS capacitive strain sensor; RF-to-DC converter; amplitude shift keying passive telemetry; capacitive signal; continuous time synchronous detection architecture; inductive coupled coils; interface sensing electronics; low-noise integrated sensing electronics; signal processing; thermal compensation; two-channel digital phase shift keying; wireless data transmission rate; wireless strain sensing microsystem; Capacitance; Capacitive sensors; Couplings; DC-DC power converters; Micromechanical devices; Phase shift keying; Radio frequency; Signal processing; Voltage; Wireless sensor networks;
Conference_Titel :
Emerging Information Technology Conference, 2005.
Print_ISBN :
0-7803-9328-7
DOI :
10.1109/EITC.2005.1544332