Title :
A Novel Copper Reflow Process Using Dual Wetting Layers
Author :
Hirao, S. ; Satake, M. ; Kamada, H. ; Sekiguchi, M. ; Tamaki, T. ; Mayumi, S.
Author_Institution :
Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd. Yagumo-nakamachi, Moriguchi, Osaka, 570 Japan
Conference_Titel :
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN :
4-930813-75-1
DOI :
10.1109/VLSIT.1997.623693
