DocumentCode

2580701

Title

A Novel Copper Reflow Process Using Dual Wetting Layers

Author

Hirao, S. ; Satake, M. ; Kamada, H. ; Sekiguchi, M. ; Tamaki, T. ; Mayumi, S.

Author_Institution

Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd. Yagumo-nakamachi, Moriguchi, Osaka, 570 Japan

fYear

1997

fDate

10-12 June 1997

Firstpage

57

Lastpage

58

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on

Print_ISBN

4-930813-75-1

Type

conf

DOI

10.1109/VLSIT.1997.623693

Filename

623693