DocumentCode :
2580891
Title :
Ultra-low Resistance Diret~ Contact Cu Via technology Using In-situ Chemical Vapor Cleamng
Author :
Tsuchiya, Y. ; Ueno, K. ; Donnelly, V.M. ; Kikkawa, T. ; Hayashi, Y. ; Kobayashi, A. ; Sekiguchi, A.
Author_Institution :
NEC Corp., 1120, Shimokuzawa, KANAGAWA 229, Japan
fYear :
1997
fDate :
10-12 June 1997
Firstpage :
59
Lastpage :
60
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN :
4-930813-75-1
Type :
conf
DOI :
10.1109/VLSIT.1997.623694
Filename :
623694
Link To Document :
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