Title :
Plasma resistance and behavior of polybenzoxazine polymer
Author :
Jem-Kun Chen ; I-Kuang Lin ; Fu-Hsiang Ko ; Feng-Chih Chang ; Kuo-Shen Chen
Author_Institution :
Nat. Nano Device Lab., Hsinchu, Taiwan
Abstract :
The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.
Keywords :
curing; glass transition; plasma materials processing; polymer films; thermal stability; IC manufacturing; absorption; catalyst; condensation; glass transition; heterocyclic ring; plasma resistance; polybenzoxazine structure; thermal self-curing; thermal stability; Absorption; Curing; Glass; Joining processes; Plasma properties; Plasma temperature; Polymers; Resins; Thermal stability; Water;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
DOI :
10.1109/IMNC.2003.1268745
