DocumentCode
2581555
Title
Fine pattern etching of silicon substrates by using atmospheric line shaped micro plasma source
Author
Okumura, T. ; Saitoh, M. ; Matsuda, I.
Author_Institution
Production Core Eng. Lab., Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan
fYear
2003
fDate
29-31 Oct. 2003
Firstpage
332
Lastpage
333
Abstract
In this paper, various micro plasma sources have been proposed. We have already proposed two types of line shaped micro plasma sources. This report presents a new type of line shaped micro plasma source for finer processing than the former two types and its application to fine pattern etching of a silicon substrate.
Keywords
elemental semiconductors; plasma sources; silicon; sputter etching; Si; atmospheric line shaped micro plasma source; fine pattern etching; silicon substrates; Ceramics; Chemical technology; Costs; Electrodes; Etching; Feeds; Fluid flow; Plasma sources; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-040-2
Type
conf
DOI
10.1109/IMNC.2003.1268781
Filename
1268781
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