DocumentCode :
2581579
Title :
Highly selective isotropic etching processes
Author :
Borel, S. ; Arvet, C. ; Bilde, J. ; Louis, D.
Author_Institution :
CEA, Grenoble, France
fYear :
2003
fDate :
29-31 Oct. 2003
Firstpage :
334
Lastpage :
335
Abstract :
We show how it was possible to develop an etching process of SiGe with a high selectivity to similar materials such as nitride, oxide and even pure silicon. The study of the material and process parameters has lead to an understanding of the etching mechanisms and permitted to control the selectivity so as to improve or invert it, which gave rise to new ideas of integration.
Keywords :
Ge-Si alloys; elemental semiconductors; multilayers; semiconductor materials; silicon; sputter etching; Si/sub 0.8/Ge/sub 0.2/:Si; SiGe-Si; isotropic etching; Chemicals; Etching; Germanium alloys; Germanium silicon alloys; MOS devices; MOSFETs; Plasma applications; Plasma chemistry; Plasma devices; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
Type :
conf
DOI :
10.1109/IMNC.2003.1268782
Filename :
1268782
Link To Document :
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