Failure models in power device interconnects

This paper presents failure models and associated material constants for the dominant failures in today´s power modules. The developed models and material data are used in physics-of-failure based reliability assessment of power electronics for a wide range of applications. The models presented in this paper are aimed at chip and wire modules, direct interconnect technology, and pressure contacts. Mechanisms addressed include wirebond fatigue, die attach fatigue, and gate spring failure.