Title :
Low-loss and compact millimeter-wave balun on Si
Author :
Uemichi, Yusuke ; Hatakeyama, Hideki ; Aizawa, Takuya ; Okada, Kenichi ; Kiumarsi, Hamid ; Tanoi, Satoru ; Ishihara, Noboru ; Masu, Kazuya
Author_Institution :
Electron Device Lab., Fujikura Ltd., Chiba, Japan
Abstract :
We designed and fabricated low-loss and compact microstrip line and Marchand balun composed of thick Cu and thick resin on Si substrate for millimeter-wave applications. An attenuation constant α and Q of the fabricated microstrip line are 0.17 dB/mm and 52 at 60GHz, respectively. The insertion loss and the core size of the fabricated balun are 0.6 dB at 60 GHz and 300 μm × 450 μm, respectively, which are the lowest and the smallest among the millimeter-wave baluns ever reported, to our knowledge.
Keywords :
CMOS integrated circuits; baluns; copper; field effect MIMIC; microstrip lines; silicon; Cu; Marchand balun; Si; attenuation constant; compact millimeter-wave balun; core size; frequency 60 GHz; insertion loss; microstrip line; size 300 mm; size 450 mm; Frequency measurement; Impedance matching; Insertion loss; Microstrip; Millimeter wave technology; Silicon; Substrates; CMOS technology; Millimeter wave circuits; Millimeter wave devices; Passive circuits; Thin film circuits;
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2011.5972619
