Ageing Test Results of low voltage MOSFET Modules for electrical vehicles

Author

Dupont, Laurent ; Lefebvre, Stéphane ; Bouaroudj, Mounira ; Khatir, Zoubir ; Faugières, Jean-Claude ; Emorine, Francis

Author_Institution

UniverSud, Cachan

fYear

2007

fDate

2-5 Sept. 2007

Firstpage

1

Lastpage

10

Abstract

HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.

Keywords

MOSFET; ageing; low-power electronics; power semiconductor devices; DCB substrates; ageing test results; bond wires; current 350 A; electrical connections; electrical vehicles; harshest applications; high temperature capability; low voltage MOSFET modules; power devices; standard technology; voltage 75 V; Aging; Bonding; Electric vehicles; Electrical resistance measurement; Low voltage; MOSFET circuits; Power MOSFET; Temperature; Testing; Thermal resistance; Automotive Application; High temperature electronics; Hybrid Power Integration; MOSFET; Packaging; Power Semiconductor device; Power cycling; Reliability; Thermal Stress; test Bench;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2007 European Conference on

Conference_Location

Aalborg

Print_ISBN

978-92-75815-10-8

Electronic_ISBN

978-92-75815-10-8

Type

conf

DOI

10.1109/EPE.2007.4417433

Filename

4417433