Title :
Base-plate solder reliability study of IGBT modules for aeronautical application
Author :
Lhommeau, T. ; Martin, C. ; Karama, M. ; Meuret, R. ; Mermet-Guyennet, M.
Author_Institution :
Ecole Nat. d´´Ingenieurs de Tarbes, Tarbes
Abstract :
In this work, a thermal fatigue study on IGBT modules for aeronautical application is carried out, based on accelerated thermal tests and the thermo-mechanical process simulation. The 3D thermal simulation gives us the impact of the delamination degree on the IGBT module thermal behavior and fixes the failure criterion. Element Finite thermo-mechanical simulation based and the metallurgical fatigue observations permit providing the predictive indication on the accelerated factors to predict the crack apparition and its propagation inside the solder on the basis of the creep energy dissipated.
Keywords :
insulated gate bipolar transistors; soldering; solders; thermal stress cracking; thermomechanical treatment; IGBT modules; accelerated thermal tests; aeronautical application; base-plate solder reliability; metallurgical fatigue; thermo-mechanical process simulation; Acceleration; Assembly; Delamination; Fatigue; Instruction sets; Insulated gate bipolar transistors; Nonhomogeneous media; Temperature; Thermal conductivity; Thermal factors; Acceleration factor; Aeronautical constraint; Finite Element Method; IGBT module; Reliability;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417448
