Base-plate solder reliability study of IGBT modules for aeronautical application

Author

Lhommeau, T. ; Martin, C. ; Karama, M. ; Meuret, R. ; Mermet-Guyennet, M.

Author_Institution

Ecole Nat. d´´Ingenieurs de Tarbes, Tarbes

fYear

2007

fDate

2-5 Sept. 2007

Firstpage

1

Lastpage

10

Abstract

In this work, a thermal fatigue study on IGBT modules for aeronautical application is carried out, based on accelerated thermal tests and the thermo-mechanical process simulation. The 3D thermal simulation gives us the impact of the delamination degree on the IGBT module thermal behavior and fixes the failure criterion. Element Finite thermo-mechanical simulation based and the metallurgical fatigue observations permit providing the predictive indication on the accelerated factors to predict the crack apparition and its propagation inside the solder on the basis of the creep energy dissipated.

Keywords

insulated gate bipolar transistors; soldering; solders; thermal stress cracking; thermomechanical treatment; IGBT modules; accelerated thermal tests; aeronautical application; base-plate solder reliability; metallurgical fatigue; thermo-mechanical process simulation; Acceleration; Assembly; Delamination; Fatigue; Instruction sets; Insulated gate bipolar transistors; Nonhomogeneous media; Temperature; Thermal conductivity; Thermal factors; Acceleration factor; Aeronautical constraint; Finite Element Method; IGBT module; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2007 European Conference on

Conference_Location

Aalborg

Print_ISBN

978-92-75815-10-8

Electronic_ISBN

978-92-75815-10-8

Type

conf

DOI

10.1109/EPE.2007.4417448

Filename

4417448