Title :
Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
Author :
Bouarroudj, M. ; Khatir, Z. ; Ousten, J.P. ; Dupont, Laurent ; Lefebvre, Serge ; Badel, F.
Author_Institution :
INRETS-LTN, Arcueil
Abstract :
The paper presents experimental investigations on both power and thermal cycling conditions on 600 V-200 A six-pack IGBT power modules. Both types of cycles are compared in term of thermo- mechanical stresses by using finite element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.
Keywords :
automotive components; finite element analysis; insulated gate bipolar transistors; automotive applications; current 200 A; failure modes; finite element simulations; high power IGBT modules; power cycling; stress distributions; thermal cycling; thermo-mechanical stresses; voltage 600 V; Automotive applications; Electronic packaging thermal management; Finite element methods; Insulated gate bipolar transistors; Multichip modules; Power electronics; Temperature; Testing; Thermal stresses; Thermomechanical processes; Automotive Application; High temperature electronics; Hybrid Power Integration; IGBT; Packaging; Power cycling; Power electronic modules; Thermal cycling;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417457
