Title :
Contribution to the stress grading in integrated power modules
Author :
Duchesne, Cyrille ; Lebey, Thierry ; Mermet-Guyennet, Michel ; Dutarde, Emmanuel ; Dagdag, Selim
Author_Institution :
Power Electron. Assoc. Res. Lab., Semeac
Abstract :
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
Keywords :
electronics packaging; power electronics; electric stress gradation; integrated power modules; power density; power electronics packaging; stress grading; Electronics packaging; Insulation; Multichip modules; Permittivity; Power electronics; Rail transportation; Semiconductor materials; Stress; Uniform resource locators; Voltage; Electric field distribution; Hybrid composites; Non-linear characteristics; Triple points; dielectric strength;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417459
