Characterization of interconnect coupling noise using in-situ delay-change curve measurements

Author

Sato, Takashi ; Cao, Yu ; Sylvester, Dennis ; Hu, Chenming

Author_Institution

California Univ., Berkeley, CA, USA

fYear

2000

fDate

2000

Firstpage

321

Lastpage

325

Abstract

The delay-change curve (DCC) characterizes the variation of the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25 μm test chip are presented showing good agreement with SPICE simulations

Keywords

delays; digital integrated circuits; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; timing; 0.25 micron; coupling noise waveform; in-situ delay-change curve measurements; interconnect coupling noise characterisation; interconnect delay variation; model equations; sub-nanosecond coupling noise; timing margin design; waveform extraction procedures; Circuit noise; Circuit testing; Coupling circuits; Delay; Integrated circuit interconnections; Noise measurement; Noise shaping; Semiconductor device measurement; Switches; Timing;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International

Conference_Location

Arlington, VA

Print_ISBN

0-7803-6598-4

Type

conf

DOI

10.1109/ASIC.2000.880757

Filename

880757