Hermetic packaging for power multichip modules

Author

Schulz-Harder, Jürgen ; Meyer, Andreas

Author_Institution

ELECTRO VAC CURAMIK GMBH, Regensburg

fYear

2007

fDate

2-5 Sept. 2007

Firstpage

1

Lastpage

10

Abstract

Hermetic packaging is a requirement for all applications where electronic components must be protected from corrosive environments to ensure acceptable service life. Extremely high reliability is required for space and military electronics, often utilizing hermetic packages. Metal packages with glass to metal seals are the common solution for low to medium power levels. For high power applications, high current has to be carried and high heat losses to be dissipated. Due to poor thermal conductivity and limited electric conductivity of metals used in standard hermetic packages, direct bond copper solutions have been developed.

Keywords

multichip modules; power electronics; thermal conductivity; corrosive environments; direct bond copper; electric conductivity; electronic components; hermetic packaging; high power applications; metal packages; power multichip modules; thermal conductivity; Bonding; Electronic components; Electronic packaging thermal management; Electronics packaging; Glass; Multichip modules; Protection; Seals; Standards development; Thermal conductivity; Aerospace; Cooling; Industrial application; Packaging; Thermal design;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2007 European Conference on

Conference_Location

Aalborg

Print_ISBN

978-92-75815-10-8

Electronic_ISBN

978-92-75815-10-8

Type

conf

DOI

10.1109/EPE.2007.4417533

Filename

4417533