DocumentCode :
2583618
Title :
Design and analysis of self-repairable MEMS accelerometer
Author :
Xiong, Xingguo ; Wu, Yu-Liang ; Jone, Wen-Ben
Author_Institution :
Dept. of ECECS, Cincinnati Univ., OH, USA
fYear :
2005
fDate :
3-5 Oct. 2005
Firstpage :
21
Lastpage :
29
Abstract :
In this paper, a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. If any of the working module in the main device is found faulty, the control circuit will replace it with a good redundant module. In this way, the faulty device can be self-repaired through redundancy. The sensitivity loss due to device modularization can be well compensated by different design alternatives. The yield model for MEMS redundancy repair is developed. The simulation results show that the BISR (built-in self-repair) design leads to effective yield increase compared to nonBISR design, especially for a moderate nonBISR yield. By implementing the fault tolerance feature into MEMS devices, the yield as well as the reliability of a MEMS device implemented in a SoC can be improved.
Keywords :
accelerometers; built-in self test; electron device manufacture; fault tolerance; microsensors; redundancy; system-on-chip; MEMS redundancy repair; MEMS reliability; SoC system; built-in self-repair design; device modularization; fault tolerance; microaccelerometer; self-repairable MEMS accelerometer; yield analysis; yield model; Accelerometers; Aerospace materials; Built-in self-test; Circuit faults; Fault tolerance; Fault tolerant systems; Manufacturing processes; Microelectromechanical devices; Micromechanical devices; Redundancy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2005. DFT 2005. 20th IEEE International Symposium on
ISSN :
1550-5774
Print_ISBN :
0-7695-2464-8
Type :
conf
DOI :
10.1109/DFTVS.2005.30
Filename :
1544500
Link To Document :
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