DocumentCode :
2583671
Title :
Boron Implanted Shallow Junction Formation By High-temperature/ Short-time/high-ramping-rate(400/spl deg/C/sec) RTA
Author :
Shishiguchi, S. ; Mineji, A. ; Hayashi, T. ; Saito, S.
Author_Institution :
ULSI Device Development Laboratories, NEC Corporation 1120 Shimokuzawa, Sagamihara, Kanagawa 229-11, Japan
fYear :
1997
fDate :
10-12 June 1997
Firstpage :
89
Lastpage :
90
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN :
4-930813-75-1
Type :
conf
DOI :
10.1109/VLSIT.1997.623709
Filename :
623709
Link To Document :
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