Title :
Novel packaging technology for power modules
Author :
Pluschke, N. ; Beckedahl, P.
Author_Institution :
Semikron (Hong Kong) Co., Ltd., Hong Kong, China
Abstract :
Power module packaging is driven by the ever increasing demand for higher power densities, reliability improvements and further cost reduction. The known reliability limitations of traditional solder joints and bond wires are limiting a significant power density increase, enabled by higher junction temperatures and the future utilization of wide bandgap devices. Silver sintering today has started to replace the solder joint from chips to DBC substrates, leaving one major reliability bottleneck: The bond wire interface on the chip top side.
Keywords :
integrated circuit interconnections; integrated circuit packaging; lead bonding; modules; semiconductor device packaging; semiconductor device reliability; sintering; soldering; solders; welding; DBC substrates; SKiN technology; bond wire interface; cost reduction; double side silver sintering; embedded interconnection technology; heat sink; junction temperatures; power chips; power densities; power module packaging; reliability performance; silver sinter joint; solder joints; thermal performance; welded bumps; wide bandgap devices; Flexible printed circuits; Heat sinks; Insulated gate bipolar transistors; Multichip modules; Skin; Thermal resistance; Wires;
Conference_Titel :
Industrial Electronics (ISIE), 2012 IEEE International Symposium on
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4673-0159-6
Electronic_ISBN :
2163-5137
DOI :
10.1109/ISIE.2012.6237123
