Title :
Novel multiport probing fixture for high frequency measurements in dense via arrays
Author :
Kwark, Young H. ; Kotzev, Miroslav ; Baks, Christian ; Gu, Xiaoxiong ; Schuster, Christian
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
In this paper the authors present a novel multiport probing fixture for high frequency measurements of dense via arrays. The probing fixture consists of a 36 mm by 36 mm multilayer printed circuit board plugged into an LGA socket clamped down to the device under test using custom hardware. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to deembed the probing fixture from measurements by applying multiport deembedding techniques. The effect of contact pressure on obtaining reproducible measurements is investigated.
Keywords :
calibration; electric connectors; printed circuits; radiofrequency measurement; surface mount technology; LGA socket; contact pressure effect; custom calibration substrates; dense via arrays; device under test; high frequency measurements; multilayer printed circuit board; multiport deembedding techniques; multiport probing fixture; striplines; test signal; top surface mounted coaxial connectors; Fixtures; Frequency modulation; Power measurement; Sockets; Substrates; VNA; multiport measurements; printed circuit board; probing fixture; two-tier calibration; via arrays;
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2011.5972758