• DocumentCode
    2584478
  • Title

    EMI analysis of coupled interconnects on dispersive dielectrics

  • Author

    Tang, Min ; Lu, Jiaqing ; Mao, Junfa

  • Author_Institution
    Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2011
  • fDate
    5-10 June 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper describes an efficient algorithm based on waveform relaxation with transverse partitioning (WR-TP) for simulation of frequency-dependent interconnects in the presence of electromagnetic interference (EMI). A simple and clear derivation of the relaxation sources is presented and the compact results are given. The dispersive substrate of coupled interconnects is characterized by the multi-term Debye formula. According to the differential equations derived from the equivalent circuit modeling, the full-wave finite-difference time-domain (FDTD) algorithm is utilized to capture accurate field in dispersive substrate. Numerical examples are given to validate the proposed method by comparing with existing techniques.
  • Keywords
    dielectric materials; differential equations; electromagnetic interference; finite difference time-domain analysis; waveform analysis; EMI analysis; FDTD algorithm; WR-TP; differential equations; dispersive dielectrics; electromagnetic interference; frequency-dependent coupled interconnection; full-wave finite-difference time-domain algorithm; multiterm Debye formula; transverse partitioning; waveform relaxation; Dispersion; Electromagnetic interference; Equivalent circuits; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Numerical models; Electromagnetic interference; finite-difference time-domain; frequency-dependent parameters; interconnects; waveform relaxation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-61284-754-2
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2011.5972770
  • Filename
    5972770