Abstract :
The following topics were dealt with: integrated circuits; high-speed communication applications; advanced silicon technologies; microwave power applications; millimeter-wave applications; advanced MMIC technology optimization; frequency generation; frequency conversion; CMOS technology; GaN-based power amplifiers; MM-wave technology; physics-based microwave component modelling; mixed-signal silicon ICs; linear receiver techniques; GaN device applications; terahertz device applications; microwave electron devices; radiofrequency and mm-wave high performance building blocks; phased-array radar; nonlinear active device modelling; millimeter-wave front-end components; linear and nonlinear CAD techniques; hybrid modules applications; multi-chip modules applications; RF-MEMS components; reliability; packaging; interconnects; and power amplifier technologies.
Keywords :
CAD; CMOS integrated circuits; III-V semiconductors; elemental semiconductors; frequency convertors; gallium compounds; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microwave integrated circuits; millimetre wave devices; mixed analogue-digital integrated circuits; multichip modules; optimisation; phased array radar; power amplifiers; semiconductor device models; silicon; terahertz wave devices; CAD techniques; CMOS technology; MM-wave technology; RF-MEMS components; advanced MMIC technology; advanced silicon technologies; frequency conversion; frequency generation; high-speed communication applications; hybrid modules applications; interconnects; linear receiver techniques; microwave electron devices; microwave power applications; millimeter-wave applications; millimeter-wave front-end components; mixed-signal silicon integrated circuits; multichip modules applications; nonlinear active device modelling; optimization; packaging; phased-array radar; physics-based microwave component modelling; power amplifiers; reliability; semiconductor device applications; terahertz device applications;
Conference_Titel :
Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
Conference_Location :
Amsterdam
Print_ISBN :
978-2-87487-007-1
DOI :
10.1109/EMICC.2008.4772182
