Title :
Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA
Author :
Zbrzezny, Adam Robert ; Chan, Vincent ; Lu, Hua ; Zhou, Ming
Author_Institution :
Adv. Micro Devices, Package Dev. Eng., Markham, ON
Abstract :
A digital speckle correlation (DSC) technique was applied to second level interconnects of flip chip and wire bonded packages in order to measure in-situ deformations induced by temperature cycling. The measurements allowed for the total normal and shear strains to be evaluated at various temperatures for different package types having lead-free and Sn-Pb metallurgies. It was observed that among the flip chip packages the shear strains varied with temperature and were greater for the Sn-Pb package than for the lead-free package. As expected, the BGA package with a metal ring stiffener exhibited the lowest strains. The results from the FEA model of the wire bonded PBGA correlated well with the experimental data obtained by DSC.
Keywords :
ball grid arrays; correlation methods; deformation; finite element analysis; flip-chip devices; lead alloys; lead bonding; reliability; soldering; solders; stress analysis; stress-strain relations; thermal stresses; tin alloys; BGA package; DSC method; FEA; PBGA; Sn-Pb metallurgy; SnPb; digital speckle correlation technique; finite element analysis; flip chip package; in-situ deformation; metal ring stiffener; reliability; second level interconnects; shear strain; solder joint strains; stress-strain hysteresis curves; temperature cycling; thermal strain; total normal strain; wire bonded package; Bonding; Capacitive sensors; Environmentally friendly manufacturing techniques; Flip chip; Packaging; Semiconductor device measurement; Speckle; Strain measurement; Temperature; Wire;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
DOI :
10.1109/ESIME.2007.359932
