• DocumentCode
    2585083
  • Title

    Thermomechanical Multiscale Modelling of Substrates

  • Author

    Ubachs, R. L J M ; van der Sluis, Olaf ; van Driel, W.D. ; Zhang, G.Q.

  • Author_Institution
    Dept. of Precision & Microsyst. Eng., Delft Univ. of Technol., Delft
  • fYear
    2007
  • fDate
    16-18 April 2007
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.
  • Keywords
    heat treatment; substrates; thermomechanical treatment; global-local step; homogenization method; multilayer substrates; multiple representative volume elements; thermomechanical multiscale modelling; Dielectric materials; Dielectric substrates; Iron; Metallization; Microelectronics; Nonhomogeneous media; Technological innovation; Thermal expansion; Thermal stresses; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
  • Conference_Location
    London
  • Print_ISBN
    1-4244-1105-X
  • Electronic_ISBN
    1-4244-1106-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2007.359937
  • Filename
    4201134