DocumentCode
2585083
Title
Thermomechanical Multiscale Modelling of Substrates
Author
Ubachs, R. L J M ; van der Sluis, Olaf ; van Driel, W.D. ; Zhang, G.Q.
Author_Institution
Dept. of Precision & Microsyst. Eng., Delft Univ. of Technol., Delft
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
8
Abstract
For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.
Keywords
heat treatment; substrates; thermomechanical treatment; global-local step; homogenization method; multilayer substrates; multiple representative volume elements; thermomechanical multiscale modelling; Dielectric materials; Dielectric substrates; Iron; Metallization; Microelectronics; Nonhomogeneous media; Technological innovation; Thermal expansion; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.359937
Filename
4201134
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