Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

Author

Enayati, Amin ; Brebels, Steven ; Vandenbosch, Guy A E ; Deraedt, Walter ; Räisänen, Antti V.

Author_Institution

Inter-Univ. Micro-Electron. Center (IMEC), Leuven, Belgium

fYear

2011

fDate

5-10 June 2011

Firstpage

1

Lastpage

4

Abstract

A cavity-backed antenna element is introduced and investigated for the antenna-in-package applications at 60GHz frequency band. A thin-film Silicon-based technology is used to implement the antenna element and two different configurations for 1×4 arrays of the same element. The feeding networks of the arrays are designed in such a manner that one of them has its main beam in the broad-side direction while the main beam of the second one is rotated to 45 degrees. Simulation and measurement results of return loss, radiation patterns and realized peak gains are compared.

Keywords

antenna radiation patterns; millimetre wave antennas; multichip modules; thin film devices; 3D integration; Si; antenna radiation patterns; antenna-in-package solution; broad-side direction; cavity-backed antenna element; feeding networks; frequency 60 GHz; millimeter-wave systems; return loss; thin-film MCM technology; Antenna measurements; Antenna radiation patterns; Finite element methods; Loss measurement; Phased arrays; 60 GHz communication systems; Multi-chip module technology; antenna-in-package integration; cavity-backed antenna;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International

Conference_Location

Baltimore, MD

ISSN

0149-645X

Print_ISBN

978-1-61284-754-2

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2011.5972815

Filename

5972815