Parametric Study of Fracture Properties in Polycrystalline MEMS

Author

Cacchione, Fabrizio ; Corigliano, Alberto ; Zerbini, Sarah

Author_Institution

Dept. of Struct. Eng., Politec. di Milano, Milan

fYear

2007

fDate

16-18 April 2007

Firstpage

1

Lastpage

5

Abstract

A parametric numerical study aimed at understanding the influence of the average grain size on the mechanical behaviour of polysilicon films was addressed in this paper. A 2D geometrical model of the polycrystal coupled with a finite element (FE) procedure was employed. To simulate inter-granular and trans-granular crack propagation a cohesive crack model was used. The results were finally analyzed using the Weibull weakest link approach.

Keywords

Weibull distribution; brittle fracture; cracks; elemental semiconductors; finite element analysis; grain size; micromechanical devices; semiconductor thin films; silicon; 2D geometrical model; Si; Weibull weakest link; cohesive crack model; finite element procedure; fracture properties; grain size; intergranular crack propagation; polycrystalline MEMS; polysilicon films; transgranular crack propagation; Crystallization; Finite element methods; Grain boundaries; Grain size; Mechanical factors; Micromechanical devices; Parametric study; Silicon; Solid modeling; Structural engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Conference_Location

London

Print_ISBN

1-4244-1105-X

Electronic_ISBN

1-4244-1106-8

Type

conf

DOI

10.1109/ESIME.2007.359969

Filename

4201166