Title :
Parametric Study of Fracture Properties in Polycrystalline MEMS
Author :
Cacchione, Fabrizio ; Corigliano, Alberto ; Zerbini, Sarah
Author_Institution :
Dept. of Struct. Eng., Politec. di Milano, Milan
Abstract :
A parametric numerical study aimed at understanding the influence of the average grain size on the mechanical behaviour of polysilicon films was addressed in this paper. A 2D geometrical model of the polycrystal coupled with a finite element (FE) procedure was employed. To simulate inter-granular and trans-granular crack propagation a cohesive crack model was used. The results were finally analyzed using the Weibull weakest link approach.
Keywords :
Weibull distribution; brittle fracture; cracks; elemental semiconductors; finite element analysis; grain size; micromechanical devices; semiconductor thin films; silicon; 2D geometrical model; Si; Weibull weakest link; cohesive crack model; finite element procedure; fracture properties; grain size; intergranular crack propagation; polycrystalline MEMS; polysilicon films; transgranular crack propagation; Crystallization; Finite element methods; Grain boundaries; Grain size; Mechanical factors; Micromechanical devices; Parametric study; Silicon; Solid modeling; Structural engineering;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
DOI :
10.1109/ESIME.2007.359969
