DocumentCode :
2585726
Title :
Development of an Internal Liquid Cooling System for CPU using CAE
Author :
Flores, Sebastian ; Wang, Song-Hao ; Chang, Chong-Qing
Author_Institution :
Mech. Eng. Dept., Kun-Shan Univ., Yungkang
fYear :
2007
fDate :
16-18 April 2007
Firstpage :
1
Lastpage :
5
Abstract :
Liquid cooling is currently one of the best and most immediate options for non uniform heat sources, high performance CPU/GPU. One of the main drawbacks of this alternative is that many customers may not be very enthusiastic to install a device that could some how leak into their computers. This project intends to develop a new generation liquid cooling system that is leakage-free. This paper presents the development process of an internal liquid cooling system for Center Process Unit (CPU) or Graphics Process Unit (GPU), which can be installed inside the computer case. Commercial available computer aided design (CAD) software; Computational Fluid Dynamics (CFD), rapid prototyping (RP) technology, Computer Aided Manufacturing (CAM) and computer aided engineering (CAE) were used in this forward engineering process for the design and fabrication of the critical parts. Previous work from this project emphasized on the development of an internal liquid pump, mainly by using CAD and PR technology [1]. At current stage the project is emphasized on the design, simulation and testing of different water-blocks, that work best with the flow rate of the internal pump. The optimum water-block design involves major dimensions as well as different internal geometries in order to direct the inlet fluid to a certain specific area and also various structures that can increase the heat extraction process from the CPU/GPU to the exterior of the system. The heat exchange process presents different scenarios; such as outlet fluid temperature, uniformity of temperature distribution, hot spots, pressure drop, etc. The criteria used for determining the optimum design will be discussed using CFD data, mathematical models and experimental results. Finally the results obtained with adequate working conditions as well as the system performance trends are shown graphically.
Keywords :
computational fluid dynamics; computer aided engineering; cooling; heat transfer; microprocessor chips; pumps; rapid prototyping (industrial); CAE; CAM; CFD; Center Process Unit; Graphics Process Unit; computational fluid dynamics; computer aided design software; computer aided engineering; computer aided manufacturing; forward engineering process; heat exchange process; heat extraction process; high performance CPU/GPU; higher density microprocessors; hot spots; internal geometries; internal liquid cooling system; internal liquid pump flow rate; nonuniform heat sources; optimum water-block design; outlet fluid temperature; pressure drop; rapid prototyping technology; system performance; temperature distribution; water-blocks, testing; Central Processing Unit; Computational fluid dynamics; Computer aided engineering; Computer aided manufacturing; Computer graphics; Design automation; Liquid cooling; Pumps; Software design; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
Type :
conf
DOI :
10.1109/ESIME.2007.360001
Filename :
4201168
Link To Document :
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