• DocumentCode
    2585783
  • Title

    Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis

  • Author

    Gonzalez, Mario ; Axisa, Fabrice ; Bulcke, Mathieu Vanden ; Brosteaux, Dominique ; Vandevelde, Bart ; Vanfleteren, Jan

  • Author_Institution
    IMEC, Leuven
  • fYear
    2007
  • fDate
    16-18 April 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this work, the design of flexible and stretchable interconnections is presented. These interconnections are done by embedding sinuous electroplated metallic wires in a stretchable substrate material. A silicone material was chosen as substrate because of its low stiffness and high elongation before break. Common metal conductors used in the electronic industry have very limited elastic ranges; therefore a metallization design is crucial to allow stretchability of the conductors going up to 100%. Different configurations were simulated and compared among them and based on these results, a horseshoe like shape was suggested. This design allows a large deformation with the minimum stress concentration. Moreover, the damage in the metal is significantly reduced by applying narrow metallization schemes. In this way, each conductor track has been split in four parallel lines of 15 mum and 15 mum space in order to improve the mechanical performance without limiting the electrical characteristics. Compared with the single copper or gold trace, the calculated stress was reduced up to 10 times.
  • Keywords
    electroplated coatings; finite element analysis; flexible electronics; integrated circuit interconnections; integrated circuit metallisation; silicones; finite element analysis; mechanical performance; metal conductors; metal interconnect design; metallization design; microelectronic systems; silicone material; sinuous electroplated metallic wires; stretchable electronic circuits; Conducting materials; Electronic circuits; Electronics industry; Finite element methods; Inorganic materials; Integrated circuit interconnections; Metallization; Shape; Stress; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
  • Conference_Location
    London
  • Print_ISBN
    1-4244-1105-X
  • Electronic_ISBN
    1-4244-1106-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2007.360005
  • Filename
    4201172