DocumentCode :
2585783
Title :
Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis
Author :
Gonzalez, Mario ; Axisa, Fabrice ; Bulcke, Mathieu Vanden ; Brosteaux, Dominique ; Vandevelde, Bart ; Vanfleteren, Jan
Author_Institution :
IMEC, Leuven
fYear :
2007
fDate :
16-18 April 2007
Firstpage :
1
Lastpage :
6
Abstract :
In this work, the design of flexible and stretchable interconnections is presented. These interconnections are done by embedding sinuous electroplated metallic wires in a stretchable substrate material. A silicone material was chosen as substrate because of its low stiffness and high elongation before break. Common metal conductors used in the electronic industry have very limited elastic ranges; therefore a metallization design is crucial to allow stretchability of the conductors going up to 100%. Different configurations were simulated and compared among them and based on these results, a horseshoe like shape was suggested. This design allows a large deformation with the minimum stress concentration. Moreover, the damage in the metal is significantly reduced by applying narrow metallization schemes. In this way, each conductor track has been split in four parallel lines of 15 mum and 15 mum space in order to improve the mechanical performance without limiting the electrical characteristics. Compared with the single copper or gold trace, the calculated stress was reduced up to 10 times.
Keywords :
electroplated coatings; finite element analysis; flexible electronics; integrated circuit interconnections; integrated circuit metallisation; silicones; finite element analysis; mechanical performance; metal conductors; metal interconnect design; metallization design; microelectronic systems; silicone material; sinuous electroplated metallic wires; stretchable electronic circuits; Conducting materials; Electronic circuits; Electronics industry; Finite element methods; Inorganic materials; Integrated circuit interconnections; Metallization; Shape; Stress; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
Type :
conf
DOI :
10.1109/ESIME.2007.360005
Filename :
4201172
Link To Document :
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