DocumentCode
2585783
Title
Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis
Author
Gonzalez, Mario ; Axisa, Fabrice ; Bulcke, Mathieu Vanden ; Brosteaux, Dominique ; Vandevelde, Bart ; Vanfleteren, Jan
Author_Institution
IMEC, Leuven
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
6
Abstract
In this work, the design of flexible and stretchable interconnections is presented. These interconnections are done by embedding sinuous electroplated metallic wires in a stretchable substrate material. A silicone material was chosen as substrate because of its low stiffness and high elongation before break. Common metal conductors used in the electronic industry have very limited elastic ranges; therefore a metallization design is crucial to allow stretchability of the conductors going up to 100%. Different configurations were simulated and compared among them and based on these results, a horseshoe like shape was suggested. This design allows a large deformation with the minimum stress concentration. Moreover, the damage in the metal is significantly reduced by applying narrow metallization schemes. In this way, each conductor track has been split in four parallel lines of 15 mum and 15 mum space in order to improve the mechanical performance without limiting the electrical characteristics. Compared with the single copper or gold trace, the calculated stress was reduced up to 10 times.
Keywords
electroplated coatings; finite element analysis; flexible electronics; integrated circuit interconnections; integrated circuit metallisation; silicones; finite element analysis; mechanical performance; metal conductors; metal interconnect design; metallization design; microelectronic systems; silicone material; sinuous electroplated metallic wires; stretchable electronic circuits; Conducting materials; Electronic circuits; Electronics industry; Finite element methods; Inorganic materials; Integrated circuit interconnections; Metallization; Shape; Stress; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.360005
Filename
4201172
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