Title :
Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages
Author :
Sun, Wei ; Zhu, W.H. ; Danny, Retuta ; Che, F.X. ; Wang, C.K. ; Sun, Anthony Y S ; Tan, H.B.
Author_Institution :
Packaging Anal. & Design Center, United Test & Assembly Center Ltd. (UTAC), Singapore
Abstract :
The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Non- leaded) packages. The important SMT factors such as solder pad and stencil designs will be discussed. Secondly and more importantly, this paper will detail the comprehensive experiment and simulation work done for QFN solder joint reliability modeling. A curve fitted fatigue correlation model together with the use of Schubert´s hyperbolic sine lead-free solder constitutive model will be proposed for accurate QFN solder joint reliability prediction.
Keywords :
electronics packaging; fatigue; reliability; solders; surface mount technology; QFN packages; SMT; board-level surface mount technology assembly; curve fitted fatigue correlation; hyperbolic sine lead-free solder constitutive model; quad flat nonleaded packages; solder joint reliability; solder pads; stencil designs; Assembly; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Leg; Soldering; Sun; Surface-mount technology; Testing;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
DOI :
10.1109/ESIME.2007.360010
