6-24 GHz Mixer Using 0.25 μm Enhancement Mode PHEMT Technology in a Low Cost Chip Scale Package

This paper discusses development of a 6-24 GHz mixer in a novel chip scale package. The mixer and package was fabricated together using Avago´s enhancement mode (E-mode) PHEMT technology. This chip scale package is high performance, low cost and it totally eliminates all the assembly steps (such as die attach, bond wire etc) required to package a singulated die in a package. The mixer has been tested at two different stages of fabrication, first Un-Capped (like without top-lid in case of conventional package) and after final GaAs-Capped (with top-lid on). The measured conversion loss of un-capped mixer is ~9 dB upto 22 GHz @LO=+16 dBm. Conversion loss of capped wafer is marginally lower than uncapped mixer upto 22 GHz. The IIP3 of uncapped mixer mixer is about +19 dBm and capped mixer IIP3 is about 1-2 dB lower than Capped mixer in most of the band. Rest of the performances of (Capped and Un-capped) mixers are very similar. L-R Isolation ~35 dB, L-I Isolation ~40 dB. IF test frequency is 2 GHz. To the best of author´s knowledge this is the first reported chip scale packaged Mixer.