• DocumentCode
    2586133
  • Title

    A 60-GHz LNA and a 92-GHz Low-Power Distributed Amplifier in CMOS with Above-IC

  • Author

    Pavageau, C. ; Dupuis, O. ; Dehan, M. ; Parvais, B. ; Carchon, G. ; De Raedt, W.

  • Author_Institution
    IMEC, Leuven
  • fYear
    2008
  • fDate
    27-28 Oct. 2008
  • Firstpage
    250
  • Lastpage
    253
  • Abstract
    This paper demonstrates a broadband LNA for 60-GHz WPAN and a 92-GHz low-power distributed amplifier (DA) in an advanced CMOS technology. A post-processed technology (above-IC), used for packaging and bonding pads redistribution, provides ultra-low-loss on-chip passives in a cost-effective solution. In the WPAN bandwidth (57-64 GHz), the LNA has a 13.4 dB peak gain, a NF between 5.6-6.7 dB and a gain flatness of 1.7 dB. A 3-dB bandwidth of 11 GHz is achieved. The DA shows a 6.5 dB gain and a 3-dB BW of 92 GHz, giving a 195 GHz gain-bandwidth product (GBW), for a dc power consumption of 43 mW. Thank to the asset of Above-IC, this DA performs a ratio of the GBW and power consumption of 4.31 GHz/mW, which is by far the best reported tradeoff among similar architecture in CMOS, at least 2.8 times higher than others.
  • Keywords
    CMOS integrated circuits; MIMIC; distributed amplifiers; low noise amplifiers; low-power electronics; millimetre wave amplifiers; CMOS technology; LNA; WPAN bandwidth; above-IC; bandwidth 11 MHz; bandwidth 195 GHz; bonding pads redistribution; dc power consumption; frequency 57 GHz to 64 GHz; frequency 92 GHz; gain 1.7 dB; gain 13.4 dB; gain 6.5 dB; gain-bandwidth product; low-power distributed amplifier; noise figure 5.6 dB to 6.7 dB; post-processed technology; power 43 mW; ultralow-loss on-chip; Bonding; CMOS technology; Copper; Distributed amplifiers; Energy consumption; Gain; Millimeter wave technology; Packaging; Passivation; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-2-87487-007-1
  • Type

    conf

  • DOI
    10.1109/EMICC.2008.4772276
  • Filename
    4772276