• DocumentCode
    2586157
  • Title

    Underexpanded Micro-nozzle Flow Simulation with Coupled Thermal-Fluid Modeling

  • Author

    Quesada, José Hermida ; Moríñigo, José A. ; Requena, Francisco Caballero

  • Author_Institution
    Dept. Aerodynamics & Propulsion, Nat. Inst. for Aerosp. Technol., Madrid
  • fYear
    2007
  • fDate
    16-18 April 2007
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Simulation of micro-thrusters intended for space propulsion relies on accurate modeling of those physical processes that occur highly coupled in the micron-sized scale. In fact, micronozzles exhibit significant differences when compared to their large-scale counterparts, so their modeling requires accounting for specific aspects to achieve success in the prediction. The goal of the present investigation is to simulate the steady and transient operation of a micro-thruster in underexpansion for cold and hot inert gas under a multiphysics, continuum-based Navier-Stokes approach with slip-flow conditions. The modeling incorporates three major effects: gas rarefaction in the slip regime, viscous dissipation and solid-gas heat transfer. Non-equilibrium effects have been addressed with the implementation of a 2nd -order slip-model for velocity and temperature on the walls. The results summarize the attained micro-thruster performance and wafer thermal response. Their dependence on the thermal-fluid coupling is analyzed.
  • Keywords
    Navier-Stokes equations; aerospace propulsion; flow simulation; heat transfer; inert gases; microfluidics; nozzles; space vehicles; cold inert gas; continuum-based Navier-Stokes approach; coupled thermal-fluid modeling; gas rarefaction; hot inert gas; microthrusters; solid-gas heat transfer; space propulsion; steady operation; transient operation; underexpanded micronozzle flow simulation; Combustion; Geometry; Performance analysis; Propulsion; Solid modeling; Space missions; Space technology; Space vehicles; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
  • Conference_Location
    London
  • Print_ISBN
    1-4244-1105-X
  • Electronic_ISBN
    1-4244-1106-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2007.360025
  • Filename
    4201192