DocumentCode :
2586497
Title :
High Voltage 3D-Capacitor
Author :
Berberich, S.E. ; Bauer, A.J. ; Ryssel, H.
Author_Institution :
Fraunhofer Inst. of Integrated Syst. & Device Technol., Erlangen
fYear :
2007
fDate :
2-5 Sept. 2007
Firstpage :
1
Lastpage :
9
Abstract :
In this work, we introduce a high voltage 3D-capacitor as a novel passive power device for a 400 V application. This device is realized in silicon technology which allows process reproducibility, high accuracy in capacitance values, and high quality of the dielectric layers (i.e., endurance at high electric field strengths). It can be manufactured discrete or as part of a monolithic integrated circuit. The outstanding properties of the device are a high ratio of capacitance value to consumed silicon area (capacitance enlargement of more than a factor of 16 in comparison to plane capacitors) and very stable capacitance values over a broad temperature range (i.e., average of 24 ppm/degC from 20-175degC).
Keywords :
capacitors; elemental semiconductors; passive networks; power semiconductor devices; silicon; Si; dielectric layers; high ratio capacitance; high voltage 3D capacitor; monolithic integrated circuit; passive power device; voltage 400 V; Capacitance; Capacitors; Dielectric devices; Integrated circuit manufacture; Integrated circuit technology; Monolithic integrated circuits; Reproducibility of results; Silicon; Temperature distribution; Voltage; Power semiconductor device; monolithic power integration; passive component integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
Type :
conf
DOI :
10.1109/EPE.2007.4417708
Filename :
4417708
Link To Document :
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