• DocumentCode
    2586804
  • Title

    Atomistic Simulations of Interface Properties in Metals

  • Author

    Shimokawa, Tomotsugu

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Kanazawa Univ., Kanazawa
  • fYear
    2007
  • fDate
    16-18 April 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The effects of grain boundary structure on the mechanical properties of polycrystalline aluminum are investigated by using molecular dynamics and quasicontinuum simulations. Three problems are simulated: (a) tensile deformation of nanocrystalline aluminum with different grain boundary misorientation distributions, (b) interaction between edge dislocations and tilt grain boundaries, and (c) grain boundary motion under shear deformation. It is found that the arrangements of grain boundary dislocations, which are determined not only by the misorientation angle but also by the deviation angle, strongly control the grain boundary motion; therefore, it is concluded that individual grain boundary structures influence the macroscopic mechanical properties in nanostructured materials.
  • Keywords
    aluminium; edge dislocations; interface phenomena; molecular dynamics method; nanostructured materials; shear deformation; tensile strength; tilt boundaries; Al; atomistic simulations; edge dislocations; grain boundary dislocations; grain boundary motion; grain boundary structure; interface property; mechanical property; molecular dynamics simulations; nanocrystalline aluminum; polycrystalline aluminum; shear deformation; tensile deformation; tilt grain boundaries; Aluminum; Capacitive sensors; Deformable models; Grain boundaries; Mechanical factors; Microscopy; Motion control; Nanostructured materials; Tensile stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
  • Conference_Location
    London
  • Print_ISBN
    1-4244-1105-X
  • Electronic_ISBN
    1-4244-1106-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2007.360056
  • Filename
    4201223