• DocumentCode
    2586813
  • Title

    Requirements and strategies for semiconductor technologies for mobile communication terminals

  • Author

    Tachikawa, K.

  • Author_Institution
    NTT DoCoMo, Inc., Tokyo, Japan
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    This article will first discuss the current state and trends of the Japanese mobile communications market. In particular, the diffusion status of "i-mode", which is an Internet-access service started in the second generation system, will be focused on, as well as on the development of the number of subscribers and the "i-mode" upgrading strategy with respect to the current status and future prospects of the services supporting IMT-2000 (W-CDMA), which were launched in September 2001. These types of non-voice services are proving to be extremely effective in enlarging the mobile communications market and increasing communication traffic. Requirements for throughput speed of the CPUs and memory capacity of the devices that have been used for mobile communication terminals, however, are constantly increasing as non-voice services become more and more popular. Issues to be solved, expected performance requirements and DoCoMo\´s efforts to reduce terminal costs, will be discussed.
  • Keywords
    3G mobile communication; cellular radio; code division multiple access; mobile handsets; radio access networks; telecommunication terminals; IMT-2000; Internet-access service; Japanese mobile communications market; W-CDMA; i-mode; memory capacity; mobile communication terminals; performance requirements; second generation system; terminal costs; upgrading strategy; Communications technology; Costs; Digital signal processing; Energy consumption; Mobile communication; Mobile handsets; Multiaccess communication; Telecommunication traffic; Throughput; Web and internet services;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269155
  • Filename
    1269155