DocumentCode :
2586884
Title :
A fast concurrent power-thermal model for sub-100 nm digital ICs
Author :
Rosselló, J.L. ; Canals, V. ; Bota, S.A. ; Keshavarzi, A. ; Segura, J.
Author_Institution :
Electron. Technol. Group, Univ. de les Illes Baleares, Palma de Mallorca, Spain
fYear :
2005
fDate :
7-11 March 2005
Firstpage :
206
Abstract :
As technology scales down, the static power is expected to become a significant fraction of the total power. The exponential dependence of static power with the operating temperature makes the thermal profile estimation of high-performance IC a key issue to compute the total power dissipated in the next-generation. In this paper we present accurate and compact analytical models to estimate the static power dissipation and the temperature of operation of CMOS gates. The models are the fundamentals of a performance estimation tool in which numerical procedures are avoided for any computation to set a faster estimation and optimization. The models developed are compared to measurements and SPICE simulations for a 0.12 μm technology showing excellent results.
Keywords :
CMOS logic circuits; digital integrated circuits; integrated circuit design; power consumption; thermal analysis; 0.12 micron; CMOS gates; concurrent power-thermal model; digital IC; exponential dependence; high-performance IC; next-generation IC; operating temperature; performance estimation tool; static power dissipation; thermal profile estimation; total power dissipation; Analytical models; CMOS technology; Integrated circuit modeling; Leakage current; MOSFETs; Power dissipation; SPICE; Semiconductor device modeling; Temperature dependence; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe, 2005. Proceedings
ISSN :
1530-1591
Print_ISBN :
0-7695-2288-2
Type :
conf
DOI :
10.1109/DATE.2005.12
Filename :
1395557
Link To Document :
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