DocumentCode
2587084
Title
Fatigue Strength and Damage Behaviors of Multi-Scale Metallic Films and Multilayers
Author
Zhang, G.P. ; Zhu, X.F. ; Li, Y.P. ; Wang, Z.G.
Author_Institution
Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
6
Abstract
An understanding of fatigue reliability of thin metal films and multilayers with layer thickness ranging from micrometers to nanometers is becoming more and more important not only due to the rapid development of micro and nano technology, but also because of the demends of the fundamental research interests in small scale materials. In this paper, we will firstly present a couple of new testing methods for fatigue of metallic mutlilayers. Then, the current state in studies on fatigue strength and damage behaviors of thin metal films and multilayers are reviewed. Fatigue strength of the thin metal films investigated previously and that of the Cu-X multilayers measured by us recently were presented. Microscopic characterization of fatigue crack initiation in the thin metal films and the multilayers shows that there exists a significant variation in fatigue damage behaviors with decreasing layer thickness. The relationship between fatigue properties and microstructures of the materials, especially effects of length scale is discussed. The possible research directons about fatigue of metallic multilayers are suggested.
Keywords
copper; fatigue cracks; mechanical testing; metallic thin films; multilayers; Cu; fatigue crack initiation; fatigue damage; fatigue strength; layer thickness; metallic mutlilayers; microscopic characterization; microstructures; thin metal films; Dielectric substrates; Fatigue; Inorganic materials; Materials reliability; Materials science and technology; Microscopy; Nonhomogeneous media; Polyimides; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.360068
Filename
4201235
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