Title :
Digital and Continuous Liquid Cooling for Electronic Systems
Author :
Baelmans, M. ; Oprins, H. ; Stevens, T. ; Rogiers, F.
Author_Institution :
Dept. of Mech. Eng., Katholieke Univ. Leuven, Leuven
Abstract :
In this paper both digital and liquid cooling concepts are proposed. Microchannel cooling techniques either actuated by a separate feed pump or actuated by electrowetting are investigated and their cooling capabilities and pumping requirements are assessed. Though the continuous liquid microchannel cooling clearly outperforms the other systems with respect to global thermal resistances, the low energy consumption and the flexibility as a reconfigurable cooling system, make the electro-actuated cooling systems attractive.
Keywords :
cooling; drops; electronics packaging; electrostatic actuators; heat sinks; microchannel flow; thermal resistance; wetting; continuous liquid cooling; digital cooling; digital droplet flow; electroactuation; electronic system cooling; electrostatic actuation; electrowetting; feed pump; fluid flow; global thermal resistance; heat sink; microchannel cooling; reconfigurable system; Consumer electronics; Electronics cooling; Feeds; Geometry; Heat sinks; Heat transfer; Liquid cooling; Microchannel; Resistance heating; Thermal resistance;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
DOI :
10.1109/ESIME.2007.360071
