• DocumentCode
    2587185
  • Title

    Mechanical Stress Induced MOSFET Punch-through And Process Optimization For Deep Submicron TEOS-O/sub 3/ Filled STI Device

  • Author

    Ishimaru, K. ; Matsuoka, F. ; Takahashi, M. ; Nishigohri, M. ; Okayama, Y. ; Unno, Y. ; Yabuki, M. ; Umezawa, K. ; Tsuchiya, N. ; Fujii, O. ; Kinugawa, M.

  • Author_Institution
    Toshiba Microelectronics Corp. 1, Komukai-Toshiba-cho, Saiwaiku, Kawasaki 21 O,Japan
  • fYear
    1997
  • fDate
    10-12 June 1997
  • Firstpage
    123
  • Lastpage
    124
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
  • Print_ISBN
    4-930813-75-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.1997.623729
  • Filename
    623729
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2587185