2587185

Mechanical Stress Induced MOSFET Punch-through And Process Optimization For Deep Submicron TEOS-O/sub 3/ Filled STI Device

Ishimaru, K. ; Matsuoka, F. ; Takahashi, M. ; Nishigohri, M. ; Okayama, Y. ; Unno, Y. ; Yabuki, M. ; Umezawa, K. ; Tsuchiya, N. ; Fujii, O. ; Kinugawa, M.

Toshiba Microelectronics Corp. 1, Komukai-Toshiba-cho, Saiwaiku, Kawasaki 21 O,Japan

1997

10-12 June 1997

123

124

English

ieee

VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on

4-930813-75-1

conf

10.1109/VLSIT.1997.623729

623729