DocumentCode :
25873
Title :
A W-Band Low-Loss and Wideband LTCC Transition From Waveguide to Microstrip
Author :
Baolin Cao ; Hao Wang ; Yong Huang ; Jie Wang ; Weixing Sheng
Author_Institution :
Sch. of Electron. & Opt. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
Volume :
23
Issue :
11
fYear :
2013
fDate :
Nov. 2013
Firstpage :
572
Lastpage :
574
Abstract :
A broadband transition structure from rectangular waveguide (RWG) to microstrip line (MSL) is presented for the realization of the low-loss packaging module using Low-temperature co-fired ceramic (LTCC) technology at W-band. In this transition, a cavity structure is buried in LTCC layers, which provides the wide bandwidth, and a laminated waveguide (LWG) transition is designed, which provides the low-loss performance, as it reduces the radiation loss of conventional direct transition between RWG and MSL. The design procedure is also given. The measured results show that the insertion loss of better than 0.7 dB from 86 to 97 GHz can be achieved.
Keywords :
ceramic packaging; microstrip lines; millimetre wave devices; rectangular waveguides; waveguide transitions; LTCC; LWG; laminated waveguide transition; low-loss; low-temperature co-fired ceramic technology; microstrip line; microwave millimetre-wave applications; planar circuits; rectangular waveguide; w-band; wide bandwidth; wideband; Cavity resonators; Integrated circuit modeling; Loss measurement; Microstrip; Substrates; Waveguide transitions; LTCC; Low-loss; W-band; transition; wideband;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2013.2281431
Filename :
6609125
Link To Document :
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