Title :
New method for temperature-dependent thermal resistance and capacitance accurate extraction in high-voltage DMOS transistors
Author :
Anghel, C. ; Hefyene, N. ; Gillon, R. ; Tack, M. ; Declercq, M.J. ; Ionescu, A.M.
Author_Institution :
Electron. Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Abstract :
This work reports on the self-heating-effect (SHE) characterization of high-voltage (HV) DMOSFETs and a simple yet accurate extraction methodology of the equivalent thermal impedance of the device (thermal resistance, R/sub TH/, and capacitance, C/sub TH/). Systematic pulsed-gate experiments are used to study the influence of pulse duration and duty factor on device SHE and optimal extraction conditions. It is found that in 100 V DMOSFETs, the SHE is cancelled by using pulses with duration shorter than 2 /spl mu/s and duty factors lower than 1:100. The new extraction method uses dedicated extraction plots exploiting the gradual canceling of SHE with pulse duration and a new analytical modeling including the temperature dependence of RTH, is validated. For the first time, we report on the temperature dependence of RTH, from 25/spl deg/C up to 150/spl deg/C, in both saturation and quasi-saturation regions of DMOS, which is shown to be a quasi-linear yet significant function of the device internal temperature. Moreover, another new result is a power low-dependent thermal capacitance, as suggested by our experiments. Finally, SPICE simulations are used to validate the proposed method, and, demonstrate that a thermal-dependent thermal resistance model is highly critical for accurate advanced simulation of HV DMOS ICs.
Keywords :
power MOSFET; semiconductor device measurement; semiconductor device models; specific heat; thermal resistance; 100 V; 2 mus; 25 to 150 degC; DMOSFET; SHE; device internal temperature; equivalent thermal impedance; extraction plots; high-voltage DMOS transistors; pulse duration; pulsed-gate measurements; quasi-saturation region; self-heating-effect; temperature-dependent thermal resistance; thermal capacitance extraction; Analytical models; Capacitance; Equations; MOSFETs; Pulse measurements; Silicon; Space vector pulse width modulation; Temperature dependence; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
DOI :
10.1109/IEDM.2003.1269183