Title :
Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology
Author :
Richter, Marius D. ; Becker, Karl-F ; Böttcher, Lars ; Schneider, Martin
Author_Institution :
Dept. of RF & Microwave Eng., Univ. of Bremen, Bremen
Abstract :
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
Keywords :
Ge-Si alloys; MIMIC; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; printed circuits; system-in-package; MMIC; SiGe; cost reduction; frequency 77 GHz; integrated circuit design; integrated circuit interconnects; microvia technology; system-in-package; Drilling; Germanium silicon alloys; Integrated circuit interconnections; Integrated circuit technology; MMICs; Microstrip; RF signals; Radio frequency; Silicon germanium; Voltage-controlled oscillators;
Conference_Titel :
Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
Conference_Location :
Amsterdam
Print_ISBN :
978-2-87487-007-1
DOI :
10.1109/EMICC.2008.4772350
