High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA

In this paper the results from a study of high-voltage pulse stressing effects on ultrasound array transducers are presented. The ultrasound transducers have been implemented with a new Pb-free soldering technology, using Silver Electrically Conductive Adhesive. The conductive adhesive have been used among the platelet of piezoelectric and fingers of connection for the implementation of phased array transducer. In order to evaluate the reliability of the biomedical instrument electrical tests are proposed. Some experimental results through a measurement system for the electro-acoustic characterization of the medical probe before and after stress test are obtained and analyzed.