A 7.45 GHz BAW filter on a 3D low cost organic package

Author

Patterson, Chad E. ; Bhattacharya, Swapan K. ; Zepess, Josh ; Leiphart, Shane ; Trueheart, William G. ; Ajoian, Jack ; Coffman, Zeb ; Papapolymerou, John

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2011

fDate

5-10 June 2011

Firstpage

1

Lastpage

4

Abstract

This paper presents for the first time a 7.45 GHz (C- band) bulk acoustic wave (BAW) filter successfully packaged on Liquid Crystal Polymer (LCP) multilayer organic material. Utilizing the inherent advantages of LCP allows for a near-hermetic package with minimal loss in performance. This work utilizes state-of-the-art BAW technologies and 3D packaging techniques to create significant benefits in terms of cost, size and performance. As BAW devices extend to higher microwave frequencies, this packaging approach exhibits potential for a viable low cost solution.

Keywords

bulk acoustic wave devices; filters; hermetic seals; integrated circuit packaging; liquid crystal polymers; three-dimensional integrated circuits; 3D low cost organic package; 3D packaging techniques; BAW devices; BAW filter; bulk acoustic wave filter; frequency 7.45 GHz; liquid crystal polymer multilayer organic material; microwave frequencies; near-hermetic package; Barium; Instruments; Matched filters; Microwave filters; Packaging; Performance evaluation; Resonant frequency; Bulk acoustic wave devices; liquid crystal polymer (LCP); packaging; solidly-mounted resonator (SMR); system-on-package;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International

Conference_Location

Baltimore, MD

ISSN

0149-645X

Print_ISBN

978-1-61284-754-2

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2011.5972987

Filename

5972987