• DocumentCode
    2588726
  • Title

    Tunnel current measurements on P/N junction diodes and implications for future device design

  • Author

    Solomon, P.M. ; Frank, D.J. ; Jopling, J. ; D´Emic, C. ; Dokumaci, O. ; Ronsheim, P. ; Haensch, W.E.

  • Author_Institution
    Semicond. Res. & Dev. Center, IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    Band-to-band tunneling was studied experimentally in ion-implanted PN junction diodes with profiles representative of present and future silicon CMOS transistors. Measurements were done over a wide range of temperatures and implant parameters. Profile parameters were derived from analysis of CV characteristics, and compared to SIMS analysis. When tunneling current was plotted against distance (tunneling distance, corrected for band curvature) a quasi-universal exponential reduction of tunneling current vs. tunneling distance was found with an attenuation length of 0.38 nm, and an extrapolated tunneling current at zero tunnel distance of 5.3/spl times/10/sup 7/ A/cm/sup 2/ at 300 K. These results were used to estimate drain-substrate currents in future scaled CMOS, and it was concluded that it will be challenging to make the ITRS 2002 roadmap projections on leakage current for the low operating power and low standby power options without more innovation and device design changes.
  • Keywords
    electric current measurement; leakage currents; low-power electronics; semiconductor device measurement; semiconductor diodes; tunnelling; 0.38 nm; 300 K; CV characteristics; P/N junction diodes; band curvature; band-to-band tunneling; diode profile; drain-substrate currents; ion-implanted PN junction diodes; leakage current; low operating power; low standby power; silicon CMOS transistors; tunnel current measurement; tunneling distance; Artificial intelligence; Contact resistance; Current measurement; Data mining; Diodes; Doping profiles; Implants; P-n junctions; Temperature; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269260
  • Filename
    1269260