DocumentCode :
2588726
Title :
Tunnel current measurements on P/N junction diodes and implications for future device design
Author :
Solomon, P.M. ; Frank, D.J. ; Jopling, J. ; D´Emic, C. ; Dokumaci, O. ; Ronsheim, P. ; Haensch, W.E.
Author_Institution :
Semicond. Res. & Dev. Center, IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2003
fDate :
8-10 Dec. 2003
Abstract :
Band-to-band tunneling was studied experimentally in ion-implanted PN junction diodes with profiles representative of present and future silicon CMOS transistors. Measurements were done over a wide range of temperatures and implant parameters. Profile parameters were derived from analysis of CV characteristics, and compared to SIMS analysis. When tunneling current was plotted against distance (tunneling distance, corrected for band curvature) a quasi-universal exponential reduction of tunneling current vs. tunneling distance was found with an attenuation length of 0.38 nm, and an extrapolated tunneling current at zero tunnel distance of 5.3/spl times/10/sup 7/ A/cm/sup 2/ at 300 K. These results were used to estimate drain-substrate currents in future scaled CMOS, and it was concluded that it will be challenging to make the ITRS 2002 roadmap projections on leakage current for the low operating power and low standby power options without more innovation and device design changes.
Keywords :
electric current measurement; leakage currents; low-power electronics; semiconductor device measurement; semiconductor diodes; tunnelling; 0.38 nm; 300 K; CV characteristics; P/N junction diodes; band curvature; band-to-band tunneling; diode profile; drain-substrate currents; ion-implanted PN junction diodes; leakage current; low operating power; low standby power; silicon CMOS transistors; tunnel current measurement; tunneling distance; Artificial intelligence; Contact resistance; Current measurement; Data mining; Diodes; Doping profiles; Implants; P-n junctions; Temperature; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
Type :
conf
DOI :
10.1109/IEDM.2003.1269260
Filename :
1269260
Link To Document :
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