Title :
Current status of the phase change memory and its future
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
With the increasing challenge of scaling floating gate nonvolatile memory technology to beyond 65 nm, alternative memory technologies are being investigated. Chalcogenide based phase change memory (R. Neale et al, Electronics, p56-60, 1970) is one of the alternative memory candidates. In this review, the physics and operation of phase change memory are first presented, followed by a discussion of the current status of development. Finally, the scaling capability of the technology is presented. The scaling projection shows that there is no physical limit to scaling down to the 22 nm node, with a number of technical challenges being identified.
Keywords :
random-access storage; solid-state phase transformations; 22 nm; 65 nm; GeSbTe; chalcogenide alloy; memory technology scaling capability; nonvolatile memory; phase change memory; Amorphous materials; Crystalline materials; Crystallization; Nonvolatile memory; Phase change materials; Phase change memory; Physics; Resistance heating; Switches; Temperature;
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
DOI :
10.1109/IEDM.2003.1269271