• DocumentCode
    2590553
  • Title

    Common mode rejection in electrically coupled MEMS resonators utilizing mode localization for sensor applications

  • Author

    Thiruvenkatanathan, P. ; Yan, J. ; Seshia, A.A.

  • Author_Institution
    Dept. of Eng., Univ. of Cambridge, Cambridge, UK
  • fYear
    2009
  • fDate
    20-24 April 2009
  • Firstpage
    358
  • Lastpage
    363
  • Abstract
    Measuring shifts in eigenstates due to vibration localization in an array of weakly coupled resonators offer two distinct advantages for sensor applications as opposed to the technique of simply measuring resonant frequency shifts: (1) orders of magnitude enhancement in parametric sensitivity and (2) intrinsic common mode rejection. In this paper, we experimentally demonstrate the common mode rejection capabilities of such sensors. The vibration behavior is studied in pairs of nearly identical MEMS resonators that are electrically coupled, and subjected to small perturbations in stiffness under different ambient pressure and temperature. The shifts in the eigenstates for the same parametric perturbation in stiffness are experimentally demonstrated to be over three orders of magnitude greater than corresponding resonant frequency variations. They are also shown to remain relatively constant to variations in ambient temperature and pressure. This increased relative robustness to environmental drift, along with the advantage of ultra-high parametric sensitivity, opens the door to an alternative approach to achieving higher sensitivity and stability in micromechanical sensors.
  • Keywords
    micromechanical resonators; microsensors; coupled resonators; eigenstates; electrically coupled MEMS resonators; intrinsic common mode rejection; magnitude enhancement; micromechanical sensors; mode localization; parametric sensitivity; resonant frequency shifts; vibration localization; Couplings; Frequency measurement; Micromechanical devices; Resonant frequency; Robust stability; Sensor arrays; Temperature dependence; Temperature sensors; Thermal force; Vibration measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 2009 Joint with the 22nd European Frequency and Time forum. IEEE International
  • Conference_Location
    Besancon
  • ISSN
    1075-6787
  • Print_ISBN
    978-1-4244-3511-1
  • Electronic_ISBN
    1075-6787
  • Type

    conf

  • DOI
    10.1109/FREQ.2009.5168201
  • Filename
    5168201